Steve Hernandez|
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2023-02-07 21.56.21.jpgHere is the anodic bonder unit with a piece of borosilicate glass and silicon sandwiched between the alum oxide insulators, electrode, and plates. A typical bonding session will be at ~400C and around 1000 VDC for 30 mins.JPEG Image - 3.79 MB - 02/08/2023 at 03:09 |
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2023-01-24 22.12.11.jpgBefore I put in the clamping system - I was stacking weights on topJPEG Image - 3.82 MB - 02/08/2023 at 03:09 |
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2023-01-18 20.52.57.jpgWiring was pretty straightforward. It's 120V system for the heater controller. The heater controller is connected to the heating plugs, a mosfet to control the power, and a thermocouple.JPEG Image - 4.58 MB - 02/08/2023 at 03:09 |
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Easy-Bond : Anodic Bonder
This was a quick build of an anodic bonding unit commonly used to hermetically bond borosilicate glass to silicon and other metals.